For all interconnect and joining applications in electronics and hybrid packaging and assembly processes, Indium Corporation offers a complete range of solder preforms that includes their full range ...

Indium Corporation will feature LV1000 solder preform flux coating at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging ...

Indium Corporation ® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of ...

Indium Corporation announces the release of its newest informational video detailing the benefits of using low-temperature solder alloy systems based on indium and bismuth. This brief video features ...