Abstract: Increased functional density and reduced input/output (I/O) spacing are the market trends in the electronics manufacturing industry. Industry reports indicate that approximately 50%-70% of ...

In recent years, legal frameworks to enhance the energy efficiency of buildings have become stricter worldwide. Particularly within the EU, the Energy Performance of Buildings Directive adopted in ...

In the solder paste process (SMT), the minimum safe distance between the SMD pads and the inline pads is recommended to be 0.4mm to 1mm. this distance effectively prevents solder paste bridging, ...

Hi, I'm Bill. I'm a software developer with a passion for making and electronics. I do a lot of things and here is where I document my learning in order to be able to inspire other people to make ...

TDK has created a range of surface-mount high-current common-mode chokes. “Customers who prefer reflow soldering but need high-current common-mode chokes can now get an SMD solution,” according to the ...

In context: The Raspberry Pi Foundation's latest release, the Pi 500 Keyboard PC, integrates the powerful Raspberry Pi 5 into a sleek, compact keyboard design. The innovative form factor positions the ...

In the surface assembly process of electronic products, especially in the high-volume reflow soldering process, the tombstone effect of passive chip components to the PCBA assembly soldering adds a ...

Thanks to Apple’s move to its own chips, the Mac has been on a roll recently, after a frustrating spell of bad keyboards, poor ports, and overheating with pre-M1 Macs. But not all of those old Macs ...

In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – soldering ...